IST strives to provide superior service in the driver IC packaging and testing for TFT-LCD, STN, OLED and PDP panel industries and packaging of smart card module. We offer a wide range of turnkey solutions from wafer bumping, probing, IC assembly, test, and outline punching. Our customization services include:

• Total Turnkey Solutions
• Wafer Bumping
  Au Bumping/Solder Bumping
• Wafer Probing
• IC Packaging
  TCP/COF/COG/COF Module/WLCSP
• IC Test
• Outline Punching
• Smart Card Module
• RFID Module
• TCP/COF Tape Designation and Application Development
• Test Program Development and Conversation
• Reliability Testing and Failure Analysis Services